Point d'origine
Hunan, China
Matière première principale
Ag
Utilisation
Emballage, Transport, Électronique
Autres Noms
silver conductive paste
EINECS No.
silver conductive ink
Classification
Autres adhésifs
Typical Application 1
Ceramic Thick Film Circuits
Typical Application 2
GPS Dielectric Rod Antennas
Typical Application 3
Thick Film Heaters
Typical Application 4
Chip Component
Typical Application 5
Ozonator
Benefit 2
Good Solderability
Benefit 3
Excellent Ageing Resistance
Benefit 4
Good Conductivity
Substrates
Ceramic (including BEO)