Point d'origine
Guangdong, China
Numéro de Type
Thermal pad T-1
Application
Haute température
Résistance à la traction
10-12MPa
products name
Soft Thermal conductive pad
Filler Material
Ceramic filler
Elastomer Type
silicon rubber
Application
Communication equipment,Memory module,Heat pipe assembly,etc.
Style
Heatsink Cooling Sheet Insulation Paste for Computer and Laptop
operating temperature
-50-200℃
Thermal Conductivity
1-5W/m.K,≥6W/m.K
Size
200*200*0.3mm,customize
color
Wathet,light purple,Pink,Gray,Customizable