Point d'origine
Guangdong, China
Type
Autres services d'usinage
Micro usinant ou pas
Micro-usinage
Numéro de Type
DXQD-22001-4
Product name
Bonding cutter for semiconductor package
Dimension
4 mil, 5 mil,6 mil,8 mil,10 mil,12 mil, 15 mil,20 mil
Equipment
Semiconductor aluminum wire bonding
Application
automotive electronics IGBT triode diode
Feature
high hardness, high grinding, long life, improve product yield